会议日程

Agenda

2017年11月16日，星期四

Nov 16, Thursday, 2017

地点：北京稻香湖景酒店牡丹厅

Venue: Peony Ballroom, Nirvana Resort Beijing

开幕式

Opening Ceremony

08:30-08:50

中国半导体行业协会领导致词

Address, CSIA

北京市及相关部委领导致辞

Address, Beijing and Relative Departments

08:50-09:00

签约仪式

Signnature Ceremony

高峰论坛

Top Forum

09:00-09:30

砥砺前行的中国IC设计业

-- 中国半导体行业协会集成电路设计分会理事长 魏少军教授

-- Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:30-09:45

打造国际化集成电路产业发展生态（拟）

-- 中关村发展集团主要领导

Build International IC Industry Development Ecosystem（Draft）

-- Major Leader of Zhongguancun Development Group

09:45-10:00

技术+制造 - 打造集成电路产业生态

-- 紫光集团董事长 赵伟国先生

Technology+Foundry-To Build IC Industry Ecosystem

-- Mr. Weiguo Zhao, Chairman of Unisgroup

10:00-10:20

Smart, Secure Everything from Silicon to Software

-- Mr. Chi-Foon Chan, President and co-CEO, Synopsys

10:20-10:40

英特尔精尖制造 : 大浪淘沙，永立潮头

-- 英特尔公司全球副总裁兼中国区总裁 杨旭先生

Intel Technology and Manufacturing: Leading at The Edge

-- Mr. Ian Yang,Corporate Vice President, President, Intel China

10:40-11:00

从万物互联到万物智联

-- 芯原控股有限公司董事长兼总裁 戴伟民博士

From IoT to AIoT

-- Dr. Wayne Dai, Chairman,President and CEO, VeriSiliconHoldings Co., Ltd.

11:00-11:20

半导体行业的整合化vs.专业化

-- 明导电子中国区总经理 凌琳先生

Semiconductor Consolidation vs. Specialization

-- Mr. Pete Ling, China Country Manager, Mentor, A Siemens Business

11:20-11:40

TBD

-- 台积电（南京）总经理 罗镇球先生

11:40-12:00

系统战略推动梦想成真

-- Cadence中国区总经理 徐昀女士

SDE, One Step from Dream to a Reality

-- Ms. Sherry Xu, China Country Manager, Cadence

12:00-13:25

自助午餐 Buffet Lunch

13:25-13:30

幸运抽奖 Lucky Draw

13:30-13:50

半导体展望: 人工智能带来新动能

-- 联华电子总经理 简山杰先生

Semiconductor Innovation Gears up Artificial Intelligence Revolution

-- Mr. S. C. Chien, Co-president, UMC

13:50-14:10

拓展工艺及设计服务, 创新产业链合作模式

-- 中芯国际集成电路制造有限公司执行副总裁 汤天申先生

SMIC’s Innovations in Ecosystem Collaboration for Design Services & Technology Offerings

-- Mr. Tianshen Tang, EVP, SMIC

14:10-14:30

Connected to Singularity: AI+Driving IC Growth in China

-- Arm全球执行副总裁兼大中华区总裁 吴雄昂先生

-- Mr. Allen Wu, EVP and President of Greater China, Arm

14:30-14:50

激发主流物联网半导体技术，打造智能解决方案

-- 格芯物联网及市场副总裁 Rajeev

Rajan先生

Unleashing Semiconductor Technologies for Mainstream IoT to Intelligent Solutions

-- Mr. Rajeev Rajan, VicePresident, Internet of Things (IoT) and Marketing, GLOBALFOUNDRIES

14:50-15:10

开放合作，创新融合，EDA助力产业跨界多赢

-- 北京华大九天软件有限公司副总经理 杨晓东先生

Seizing the Opportunity That Open Innovation Offers Us to Achieve Multi-win for Industry by Electronic Design Automation

-- Mr. Steve Yang, VP, Huada Empyrean Software Co., Ltd.

15:10-15:30

芯片制造助力全球创新转型

-- 上海华力微电子有限公司市场部部长 杨展悌先生

IC Manufacturing Facilitates Technological Innovation and Upgrading Globally

-- Mr. James Yang, Marketing Director, Shanghai Huali Microelectronics Corporation

15:30-15:45

茶歇，交流 Coffee Break

15:45-15:50

幸运抽奖Lucky Draw

15:50-16:10

设计自动化大会（DAC）：学业两界芯片设计与设计自动化从业人员的顶级聚会

-- 设计自动化大会执行委员会委员兼Designer Track主席，Cadence电子科技有限公司研发总监 李卓先生

Design Automation Conference: THE Premier Gathering Place for Designers, Design Tool Developers,

Researchers, and Managers

-- Mr. Zhuo Li, Design Automation

Conference Executive Committee Member and Designer Track Chair, Engineering Director, Cadence Design Systems

16:10-16:30

IC新生态下的企业信息安全

-- 北京志翔科技股份有限公司CEO 蒋天仪先生

Information Security in the New Semiconductor Ecosystem

-- Mr. Tianyi Jiang, CEO, Zshield Inc.

16:30-16:50

摩尔精英让中国没有难做的芯片

-- 摩尔精英CEO 张竞扬先生

MooreElite - To Make IC Design Business Easy & Fun

-- Mr. Jing-Yang JY Zhang, CEO, MooreElite Group

16:50-17:10

14nm和10nm Finfet工艺下如何轻松集成IP

-- 芯动科技有限公司CEO 敖海先生

Smooth Integration of Interface IP at 14/10nm

-- Mr. Gordon Ao, CEO of INNOSILICON TECHNOLOGY LTD

17:10-17:30

芯片设计在物联网时代的机遇与挑战

-- 成都锐成芯微科技股份有限公司

CEO 向建军先生

New Opportunity and Challenge from IoT

-- Mr. Jianjun Xiang, CEO, ChengduAnalog Circuit Technology Inc.

17:30-17:50

终端应用趋势

-- 小米供应链副总裁，江苏紫米电子技术有限公司创始人、CEO 张峰先生

17:50-17:55

幸运抽奖Lucky Draw

19:30-21:30

欢迎晚宴（Synopsys公司赞助）

Welcome Dinner Banquet (Sponsored by Synopsys)

地点：北京稻香湖景酒店牡丹厅

Site: Peony Ballroom, Nirvana Resort Beijing

2017年11月17日，星期五

Nov 17, Friday,2017

专题论坛（二）

Subject Forum(Ⅱ)

地点：北京稻香湖景酒店牡丹1厅

Venue: Peony Ballroom 1, NirvanaResort Beijing

FOUNDRY与工艺技术

Foundry and Manufacturing Process Technology

09:00-09:20

台积电的领先技

术：7奈米/12奈米/22奈米

TSMC Technology Leadership: N7/N12/N22

台积电中国业务发展技术经理，何瑞灵

Ray He, Technical Manager, Business Development, TSMC

09:20-09:40

格芯智能制造/工业4.0

GlobalFoundries Smart Manufacturing/ Industry 4.0

格芯全球副总裁兼大中华区总经理，白农

Wallace Pai, Vice President and General Manager of Greater China, GLOBALFOUN-DRIES

09:40-10:00

迎接即将爆发的新产品应用浪潮 - 晶圆专工在特殊工艺的技术创新

Foundry Innovation on Specialty Technology for Emerging Applications

联华电子副总经理，刘士维

Steven Liu, Senior Vice President, UMC

10:00-10:20

垂直生态系统及跨行业合作

Vertical Channel Eco-System & Cross-Industry Cooperation

中芯国际集成电路制造有限公司垂直市场生态策略总监，吴耿源

KY Wu, Director of Vertical Channel Marketing,SMIC

10:20-10:40

华力微电子28纳米低功耗工艺技术

HLMC 28LP PolySiON Technology

上海华力微电子有限公司研发二部总监，彭树根

Albert Pang, Senior Director of TD, Shanghai Huali Microelectronics Co., Ltd.

10:40-11:00

让中国没有难做的芯片，摩尔FOC

(Fabless Operation Cloud)

助力IC设计公司发展

To Make IC Design Business Easy & Fun,MooreElite FOC (Fabless Operation Cloud) Enables Small Fabless Start-ups

摩尔精英CEO，张竞扬

Jing-Yang JY Zhang, CEO, MooreElite Group

11:00-11:20

深耕模拟与功率半导体制造，助力集成电路成长

CSMC,

Specialized in Analog and Power Management Foundry and Boosted Customer's Growth

华润上华科技有限公司市场销售副总，邵军

Jun Shao, VP of Marketing and Sales, CSMC

11:20-11:40

三重富士通车规级芯片制造开发与质量管理

Mie Fujitsu Semiconductor Automotive IC Manufacturing and Quality Management

三重富士通半导体股份有限公司市场部部长，罗良辅

Liangfu Lo, Director (Aisa & Korea) of Marketing Dept., MIE Fujitsu Semiconductor Limited

11:40-12:00

智能时代，畅想“芯”机遇

Opportunities in the Smart Era

上海华虹宏力半导体制造有限公司战略、市场与发展部门部长，胡湘俊

Calvin Hu, Director of Strategy, Marketing and Development Division,

Shanghai Huahong Grace Semiconductor Manufacturing Corporation

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

13:30-13:50

特种工艺链接世界

A World Connected by Specialty Technologies

TowerJazz中国区总经理，秦磊

Lei Qin, Senior Sales Director China Country Manager, TowerJazz

13:50-14:10

流片服务对于芯片研发和产品成功的重要性

Professional Tapeout Service Plays a Key Role in R&D and Market Success

MOSIS专业流片服务机构业务拓展经理，袁泉

Quan Yuan, Business Development Manager, The MOSIS Service

14:10-14:30

AMS尖端模拟工艺平台,助力客户进入高毛利市场

AMS High Performance Analog Process Support Customer Enter High Profit Market

上海劢仕电子有限公司市场部经理，周之琦

Zhiqi Zhou, Marketing Manager, Shanghai MEDs Technology Co., Ltd.

14:30-14:50

武汉新芯特种工艺平台

XMC Specialty Process Platform

武汉新芯集成电路制造有限公司芯片代工事业部总监，沈亮

Neo Shen, Director of Foundry Service Business Unit, XMC

14:50-15:10

茶歇，交流Coffee Break

资本与IC设计业

Capital and IC Design Industry

15:10-15:30

TBD TBD

15:30-15:50

TBD TBD

15:50-16:10

风口浪尖上的中国半导体

China IC in Big Waves

华登国际董事总经理，黄庆博士

Dr. Hing Wong,Managing Director(MD), Walden International

自由研讨 — IPO、企业并购和商业经营，产业发展缺一不可的路径

Panel – IPO, M & A and Business Operation,Integral Industry Development Way

16:10-17:30

研讨嘉宾：魏少军、陈大同、黄庆、高松涛等

在举国半导体投资发展热潮中，中国集成电路设计行业也有了长足的发展，继紫光集团成功收购展讯锐迪科之后；清芯华创牵头收购豪威科技，武岳峰牵头收购ISSI，兆易创新成功IPO成为全体中国IC设计公司瞩目的最新焦点！

那么，下一个兆易创新会在哪里？近距离面对中国这个最让人魂系神往的资本市场，我们中国集成电路设计企业应该如何才能淡定应对？全球集成电路行业会在那个层面展开新一轮的创新竞争？

Honored Guests：Prof. WeiShaojun, Dr. Chen Datong, Dr. Hing Wong, Mr. Gao Songtao, etc.

Under the Tide of National Semiconductor Investment and Development, China IC Design Industry has been Developing

Rapidly. After UnisGroup successfully Acquired Spreadtrum and RDA, Hua Capital led to Acquire OmniVision, Summit View Capital led to Acquire ISSI, China IC Design Industry is all Focusing on Giga Device successful IPO！

Then, Where is Next Giga Device?

When closely Facingthis China Charming Capital Market, How shall We China IC Design Industry Respond Calmly? What’s Next Innovation Competition for Global IC Industry?

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点：北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

2017年11月17日，星期五

Nov 17, Friday,2017

专题论坛（三）

Subject Forum(Ⅲ)

地点：北京稻香湖景酒店牡丹2厅

Venue: Peony Ballroom 2, NirvanaResort Beijing

IP与IC设计（II）

IP and IC Design (II)

09:00-09:20

创新驱动产业跨越——国产通用CPU发展启示录

Domestic CPU: Innovation Help Local IC Industry to Thrive

上海兆芯集成电路有限公司副总裁，傅城

ChengFu, VP, Shanghai Zhaoxin Semiconductor Co., Ltd.

09:20-09:40

台积电7nm先进工艺下的设计方法

TSMC N7 Digital Design Enablement

台积电南京设计服务中心部门经理，曹宗良

Z.L. CAO, Department Manager, Nanjing Design Service Center, TSMC

09:40-10:00

高效的处理架构让AI无处不在

An Efficient Processor Architecture Enable AI Everywhere

芯原控股有限公司执行副总裁、

IP事业部总经理、首席战略官，戴伟进

Weijin Dai, Executive Vice President, GM of IP Division and Chief Strategy Officer, VeriSilicon Holdings Co., Ltd.

10:00-10:20

面向物联网设备的平台安全架构

Platform Security Architecture for IoT Device

Arm高级技术市场经理，王骏超

Eric Wang, Senior Technical Marketing Manager, Arm China

10:20-10:40

高度定制化IP解决方案的现状和展望

The Trend and Prospect of Highly Customized IP Solution

芯动科技有限公司FAE总监，何颖

Huck He, FAE Director, Innosilicon Technology Ltd.

10:40-11:00

汽车MCU软件、硬件平台型开发技术

Discussion of Auto MCU Softwareand Hardware Platform Development Technology

恩智浦半导体汽车控制器和处理器事业部亚太市场总监，易生海

Jerwern Yi, Marketing Director, Asia Auto MCU and MPU, NXP

11:00-11:20

人工智能时代的2.5D/3D先进封装设计

2.5D/3D Advanced Packaging Design for Artificial Intelligence Era

苏州芯禾电子科技有限公司创始人/工程副总裁，代文亮

Dai Wenliang, Founder VP Engineering, Xpeedic Technology

11:20-11:40

浅谈人工智能时代的高性能计算芯片

Brief Discussion of High Performance Computing Chip in AI Era

无锡华大国奇科技有限公司

CEO，谷建餘

Jianyu Gu, CEO, Qualchip Technologies, Inc.

11:40-12:00

现今趋势中在线存储器测试与修复之应用

The Trend of Memory on Demand Test and Repair of Applications

厚翼科技中国区销售总监，王炳兴

Benson Wang, VP of China Region, HOYTechnologies Corp.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐 Buffet Lunch

13:30-13:50

The Challenge of Systemic

Complexity: The Need for An Architecture for Debug, Safety & Security Rupert Baines, CEO, UltraSoC

13:50-14:10

M31低功耗套装平台

M31 Low Power Platform

円星科技股份有限公司业务副总监，林世腾

Johnson Lin, Deputy Sales Director, M31 Technology

14:10-14:30

针对NB-IoT终端设备的单处理器核完整IP方案

Complete Single Processor IP Solution for NB-IoT Enabled Endpoint Devices

CEVA中国FAE经理，杨晔

Luke Yang, China FAE Manager, CEVA

14:30-14:50

领导变革-芯片行业如何部署技术创新和外包战略

Leading the Disruptions - How does Industrials & Electronics Industry Deploy Technology Innovation and Outsourcing Strategy

亚创中国半导体事业部总监，石贤帅

Xianshuai (Stone) Shi, I&E Division Director, Altran China

14:50-15:10

茶歇，交流

15:10-15:30

Chips&Media面向监控/车载应用，针对低照度环境优化的ISPIP

Chips&Media’s

Low Light Environment Optimized Image Signal Processing IP for Surveillance and Automotive Applications

Chips&Media中国区销售经理，陶南

Larry Tao, Country Manager China Sales, Chips&Media

15:30-15:50

Imagination AI解决方案激发智能社会充满想象

Imagination AI Stimulate the Innovation of Human Society

进想科技(上海)有限公司中国区市场总监，柯川

Bowen Ke, Marketing Director, Imagination Technologies

15:50-16:10

系统层级设计方法: 架构探索与高阶合成设计

Electronic System

- Level Design Methodology: Architecture Exploration & High Level Synthesis

宏太科技股份有限公司应用经理，王义成

Frank Wang, AE Manager, Avant Technology Inc.

16:10-16:30

针对自动驾驶SoC的智能互联

Intelligent Interconnect for Automotive SoCs Alex Chao, Sr. Director of Worldwide Field Applications, NetSpeed Systems

16:30-16:50

物联网应用之安全强化- 特殊型NeoFuse IP解决方案

Specialty NeoFuse

IP Simplify Security Enhancement for IoT Application

力旺电子营销副处长，郭东政

Steve Kuo,

Marketing Deputy Director, eMemory

16:50-17:10

多用途的嵌入式SuperFlash技术在物联网和汽车电子上的应用

Versatile

Embedded SuperFlash® Technology for IoT and Automotive Applications Vipin Tiwari, Director,Marketing and Business Development, Silicon Storage Technology, Inc.

17:10-17:30

物联网时代的DRAM：高速，串接简易

DRAM for IoT Applications with Low-Pin Count, High Speed, Serial Interface

爱普科技股份有限公司总经理，顾峻

Jun Gu, GM, AP Memory Technology CO., LTD.

17:30-17:35

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and FlagHandover Ceremony

地点：北京稻香湖景酒店东方苑

Site: Dongfangyuan, NirvanaResort Beijing

2017年11月17日，星期五

Nov 17, Friday,2017

专题论坛（四）

Subject Forum(Ⅳ)

地点：北京稻香湖景酒店牡丹3厅

Venue: Peony Ballroom 3, NirvanaResort Beijing

封装测试与IC设计

IC Design and Packaging & Testing

09:00-09:20

高速成长IC新应用的先进封装技术

Advance Packaging Technologies for the Fast Growing IC Applications

江苏长电科技股份有限公司高级副总裁，梁新夫

Steve Xin Liang, SVP, JCET

09:20-09:40

通富微电在Processing Unit的封测解决方案

TFME Full Backend Solution at Processing Unit

通富微电子技术中心副总，林伟

Wayne Lin, Vice President, R&D Center, TFME

09:40-10:00

芯片产品的全程可溯

IC Product Traceability Across Supply Chain

PDF中国总经理、全球副总裁，房华博士

Dr. Hua Fang, PDF-China GM, Global VP

10:00-10:20

智能芯片商机与可靠性之挑战

Business Opportunity and Challenge for AI Semiconductors

宜特检测技术有限公司董事长，崔革文

Kevin Tsui, iST China Chairman & General Manager

10:20-10:40

车用电子新一波的封装技术趋势与解决方案

New Wave Technology Trend & Packaging Solution for Automotive Application

日月光集团制造工程处处长，沈政昌

Allen Shen, Engineering Director, ASE Group

10:40-11:00

系统级封装(SiP)的市场和技术发展趋势

SiP (System in Package) Market and Technology Trend

安靠封装测试资深总监，李吕祝

John Lee, Sr. Director, Amkor Technology

11:00-11:20

高性能计算应用之创新封装解决方案

The Innovate Packaging Solutions In High Performance Computing

矽品精密工业股份有限公司研发中心客户前瞻产品处副处长，陈盟顺

Royal Chen, Deputy Director, Customer Advanced Package Application Engineering of CRD, SPIL

11:20-11:40

IC设计与Probe Card结合的重要性

IC Design and Probe Card Integration Solutions

深圳市道格特科技有限公司副总经理，李忠民

Tommy Lee, VP, Shenzhen Doctor Technology Co., Ltd.

11:40-12:00

物联网技术的测试挑战以及是德科技的解决方案

IoT Technology Test Challenges and Keysight Solutions

是德科技中华区市场部行业市场经理，祝晓悦

Xiaoyue Zhu, Marketing Industry Manager, Keysight Technologies

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:30

自助午餐Buffet Lunch

13:30-13:50

持续驱动集成电路小型化和性能提升的晶圆级封装技术

Wafer-level Packaging Technologies as A Key Enabler for Continuous Miniaturization and Performance Enhancement of Integrated Circuits

华天科技(昆山)电子有限公司技术总监，王腾

Teng Wang, Technical Director, Huatian Technology (Kunshan) Electronics Co., Ltd.

13:50-14:10

测试的发展趋势：过去，现状及预测未来

TestTrends: Past, Present and Predicting the Future

泰瑞达半导体测试部SoC商务组和市场销售副总裁兼总经理，徐建仁

Jason Zee, VP and GM, SoC Business Group and Marketing, Teradyne

14:10-14:30

R&S 最新IoT测试技术和解决方案

R&S Latest IoT Test Techniques and Solutions

罗德与施瓦茨（中国）科技有限公司业务发展主管，杨洪文

Hongwen Yang, Business Development Manager, Rohde & Schwarz (China) Technology Co., Ltd.

14:30-14:50

利用NI平台降低测试成本与加速产品上市时间

Lowering the Cost of Test while Improving Time-To-Market with NI Platform-based Approach

美国国家仪器有限公司市场工程师，马力斯

Lisi Ma, Technical Marketing Engineer, National Instruments

14:50-15:10

茶歇，交流Coffee Break

15:10-15:30

物联网时代的芯片测试解决方案

Testing Devices for the IoT and Smart Applications

爱德万测试（中国）管理有限公司北京分公司测试技术部课长，张可

Ke Zhang, Section Manager, BJT Department, Advantest (China) Co., Ltd. Beijing Branch

15:30-15:50

全方位测试解决方案

Comprehensive Semiconductor Testing Solution

京元电子股份有限公司资深处长，苏哲毅

Zheyi Su, Senior Director, KYEC Yuan Electronics Co., Ltd.

15:50-15:55

幸运抽奖Lucky Draw

18:00-20:00

闭幕晚宴及交旗仪式

Closing Banquet and Flag Handover Ceremony

地点：北京稻香湖景酒店东方苑

Site: Dongfangyuan, Nirvana Resort Beijing

2017年11月17日，星期五

Nov 17, Friday, 2017

专题论坛（五）

Subject Forum (V)

地点：北京稻香湖景酒店牡丹4厅

Venue: Peony Ballroom 4, Nirvana Resort Beijing

“芯”动北京 - 暨首届中关村IC产业发展论坛

Chip-Power Beijing and First Zhongguancun IC Industry Development Forum

09:00-09:05

海淀区政府领导致欢迎词

Welcome Speech from the Leader of Haidian District Government

09:05-09:10

中关村管委会领导讲话

Speech from the Leader of Administrative Committee of Zhongguancun Science Park

09:10-09:15

市科委领导讲话

Speech from the Leader of Beijing Municipal Committee of Science and Technology

09:15-09:30

人工智能行业研究及成果转化

Research and Result Transformation of AI Industry

清华微电子所所长，魏少军教授

Prof. Shaojun Wei, Director, Institute of Microelectron-ics, Tsinghua University

09:30-09:45

百度人工智能的基础技术及应用创新

Basic Technology and Application Innovation of Baidu AI

百度技术体系主任架构师，欧阳剑

Jian Ouyang, Director of Technology System Architect of Baidu

09:45-10:00

人工智能时代的端到端芯片战略

End-to-end Chip Strategy in the AI Era

英特尔中国研究院院长，宋继强

Jiqiang Song, General Manager, Intel Labs China

10:00-10:15

嵌入式人工智能：从算法到处理器

Embedded AI: From Algorithms to Processors

北京地平线机器人技术研发有限公创始人&CEO，余凯

Kai Yu, Founder & CEO, Beijing Horizon Robotics Technology Research and Development Co., Ltd.

10:15-10:30

智能语音技术如何商业化应用

How to Commercialize Intelligent Voice Technologies

北京云知声信息技术有限公司CEO，黄伟

Wei Huang, CEO, Unisound

10:30-10:45

智慧存储加速人工智能创新

Intelligent Storage for Artificial Intelligence

英韧创信息科技有限公司董事长兼CEO，吴子宁

Zining Wu, Chairman and CEO, InnoGrit Co., Ltd.

会议结束 Close

会议日程以最终现场公布为准。

Agendaup to final site release.